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Information on "Contracted Film Formation Services"

Maximum film formation area 400mmΦ・315mm□! Film deposition of various thin films by sputtering.

Our company offers contract film deposition of various metal materials, oxide film materials, etc., and we are particularly skilled in film deposition on plastic substrates. The usual delivery time is about one week, and patterned film deposition is also possible upon request. First, please let us know the material you wish to deposit and the substrate you will use. Based on your requirements, we will determine the pre-treatment conditions, deposition conditions, and film thickness. 【Available Substrates】 ■ Glass ■ Metal ■ Ceramic ■ Si wafers ■ Various plastic materials *For more details, please download the PDF or feel free to contact us.

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Achieving high-level DLC film deposition with proprietary sputtering technology!

DLC film formation (film quality: ta-C domain, surface roughness Ra 0.16 nm, transmittance: 88%) achieved through sputtering, which has had many challenges in the past.

The RAM CATHODE (four-sided opposing cathode) dramatically improves the ionization rate, enabling the formation of DLC (ta-C) using a DC pulse power supply without the need for HIPIMS power. 【Conventional Sputtering Method】 Due to the low ionization rate of carbon, it was necessary to use HIPIMS power to forcibly increase the ionization rate in order to obtain the ta-C region. 【RAM Cathode Developed by Our Company】 By arranging targets on four opposing sides, the magnetic field between the targets enhances plasma confinement, allowing for the formation of high-density plasma. Within the confined plasma, electrons, rebounding argon, and C flux repeatedly collide, promoting the ionization of Ar ions and C flux, which facilitates the easy formation of C-C bonds in the DLC film. As a result, we have achieved the formation of high-hardness and high-smoothness DLC without using HIPIMS power. *For more details, please refer to the PDF document or feel free to contact us.

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Fluorine film formation "CS1"

By rubbing the substrate, a fluorine barrier is instantly created!

"CS1" is a fluorine film formation that allows the substrate to generate fluorine crystals on its surface by soaking a special solution or wiping the substrate with a sheet. The film formation using the self-organization method is highly durable due to the bonding from chemical reactions. Additionally, a barrier can be formed at the atomic and molecular level, enabling anyone to easily create a uniform fluorine film. [Features] ■ Resistant to dirt ■ Easy to clean ■ Quick and easy fluorine film formation ■ Almost no impact on the operability of touch panels *For more details, please download the PDF or feel free to contact us.

  • Company:NAZCA
  • Price:Other
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